VEEFILL 303 F / H 160

Epoxy compounds for low exotherm potting

Filling an electronic assembly with an epoxy potting compound can be challenging Especially, selecting the wrong epoxy mixture can lead to a dangerous exothermic reaction. An exothermic reaction can produce enough heat to damage the components that the epoxy was intended to protect. Excess shrinkage can create stress on components or create cracks in the epoxy when cured. VEEFILL 303 F / H 160 system is a cold curing epoxy system, it is mainly used in electronic potting applications where low exotherm in required

Key Features

  • Anti-settling properties
  • Class B insulation
  • Low exothermic reaction
  • Long potlife and superior performance

Technical Data

Resin Viscosity cps @ 25°C 9000 – 15000
Resin Density g / cc @ 25°C 1.4 – 1.8
Hardener Viscosity cps @ 25°C 300 – 700
Hardener Density g / cc @ 25°C 0.97